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Comparison of the creep behaviour of a basswood waferboard to that of solid wood



Comparison of the creep behaviour of a basswood waferboard to that of solid wood



Wood and Fiber 11(3): 155-170



Flexural creep of (a) laboratory-produced waferboard, made from basswood (Tilia americana) chips, was compared with that of solid basswood stressed (b) parallel or (c) perpendicular to the grain, at RH 50, 60, 70 and 80%. Creep in (a) was intermediate between that of (b) and (c).

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Accession: 000844356

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