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Curing conditions of particleboard adhesives II. Curing of adhesives under high steam pressures or temperatures



Curing conditions of particleboard adhesives II. Curing of adhesives under high steam pressures or temperatures



Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 35(5): 419-423



The curing of UF, urea melamine formaldehyde (UMF), PF, phenol melamine formaldehyde (PMF) and isocyanate (IC) adhesives was studied at 120-200 degrees C (steam pressure 2.1-15.0 kgf/cmsuperscript 2) with steam injection times of 30-180 s. At high temp. and pressure, the max. hardness of cured UF resin was observed after short steam injection times. After max. hardness was achieved at all temp., hardness decreased with increasing injection times and the resin finally decomposed to a liquid.

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Accession: 001790421

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