EurekaMag.com logo
+ Site Statistics
References:
53,869,633
Abstracts:
29,686,251
+ Search Articles
+ Subscribe to Site Feeds
EurekaMag Most Shared ContentMost Shared
EurekaMag PDF Full Text ContentPDF Full Text
+ PDF Full Text
Request PDF Full TextRequest PDF Full Text
+ Follow Us
Follow on FacebookFollow on Facebook
Follow on TwitterFollow on Twitter
Follow on LinkedInFollow on LinkedIn

+ Translate

Curing conditions of particleboard adhesives III. Optimum conditions of curing adhesives in steam injection pressing of particleboard



Curing conditions of particleboard adhesives III. Optimum conditions of curing adhesives in steam injection pressing of particleboard



Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 35(5): 424-430



IB strength and thickness swelling were measured in particleboards bonded with UF, urea melamine formaldehyde (UMF), PF, phenol melamine formaldehyde (PMF) and isocyanate (IC) resins and pressed in a sealed steam-injection system with steam temp. of 120 degrees -180 degrees C (pressures of 2.1-10.0 kgf/cmsuperscript 2). Max. values of IB strength for UF and UMF boards were observed at lower steam temp. (120-140 degrees C) and longer pressing times (120-150 sec).

(PDF emailed within 1 workday: $29.90)

Accession: 001790422

Download citation: RISBibTeXText



Related references

Curing conditions of particleboard adhesives II. Curing of adhesives under high steam pressures or temperatures. Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 35(5): 419-423, 1989

Rapid curing of cement-bonded particleboard II. Curing mechanism of cement with sodium hydrogen carbonate during steam injection pressing. Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 42(7): 659-667, 1996

Rapid curing of cement-bonded particleboard I. Steam injection pressing of cement-bonded particleboard with sodium hydrogen carbonate. Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 41(3): 309-317, 1995

Rapid curing of cement-bonded particleboard IV. Sodium silicate as a fortifier during steam injection pressing. Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 42(8): 769-775, 1996

Rapid curing of cement-bonded particleboard V. Mechanism of strength development with fortifiers and accelerators during steam injection pressing. Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 42(10): 977-984, 1996

Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints - Part 1: Substrate influence on TTT and CHT curing diagrams of wood adhesives. Holz als Roh und Werkstoff 56(5): 339-346, 1998

Particleboard I.B. forecast by TMA bending in MUF adhesives curing. Holz als Roh und Werkstoff 58(4): 288-289, 2000

Particleboard IB forecast by TMA bending in UF adhesives curing. Holz als Roh und Werkstoff 56(3): 154, 1998

Curing urea-formaldehyde adhesives in thick particleboard mats. Adhesives for wood: research applications and needs edited by Robert H Gillespie: 239, 1984

Rapid curing of cement-bonded particleboard with silica fume I. Effects of an additive for cement hydration during steam injection pressing. Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 42(11): 1090-1097, 1996

Curing behaviour and bonding properties of thermosetting resin adhesives. IV. Curing behaviour of phenol-melamine-formaldehyde resin under various hot-pressing conditions. Mokuzai Gakkaishi = Journal of the Japan Wood Research Society 36(1): 36-41, 1990

Curing behavior and bonding properties of thermosetting resin adhesives. I. Methods for tracing the curing processes of phenol-melamine-formaldehyde adhesives. Mokuzai Gakkaishi Journal of the Japan Wood Research Society 33(3): 193-198, 1987

Particleboard research on a pilot scale: reproducing the pressing conditions of a full-sized particleboard on the small scale of a laboratory particleboard. Holz Zentralblatt 103(137/138): 2143, 1977

Low formaldehyde emission, fast pressing, pine and pecan tannin adhesives for exterior particleboard. Holz als Roh und Werkstoff 52(5): 311-315, 1994

Production of particleboard with steam-injection. 2. Computer simulation of temperatures behavior in particle mat during hotpressing and steam-injection pressing. Wood science and technology4(1): 65-78, 1990