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Studies on the manufacturing of particleboard from fast-growing tree species (IV-1) - Effect of particleboard density on the properties of the PMDI and UF glue bonded particleboard



Studies on the manufacturing of particleboard from fast-growing tree species (IV-1) - Effect of particleboard density on the properties of the PMDI and UF glue bonded particleboard



Forest Products Industries 12(1): 72-88



Using the thinnings of Japanese fir (Cryptomeria japonica) and Taiwan paulownia (Paulownia taiwaniana) trees as raw materials, and polymeric diphengmethane diisocyanate (PMDI) and UF glue as adhesive (10% glue level), 3 kinds of low density particleboard were manufactured (0.35, 0.45 and 0.55 g/cmsuperscript 3).

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