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Detection of failures of adhesively bonded joints using the acoustic emission method



Detection of failures of adhesively bonded joints using the acoustic emission method



Holzforschung 59(2): 219-229



Wooden glued constructions require touch-free monitoring of destructive processes, especially in adhesive bonds that are most exposed to failure. The objective of the investigations was to describe failure processes in the adhesive bond of wood joints, in particular to determine their initiation, propagation, and destruction.

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Accession: 004099121

Download citation: RISBibTeXText

DOI: 10.1515/hf.2005.035


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