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Simultaneous acquisition of 3D surface seismic and 3D VSP data; processing and integration



Simultaneous acquisition of 3D surface seismic and 3D VSP data; processing and integration



SEG Annual Meeting Expanded Technical Program Abstracts with Biographies 72: 2337-2340



The first 3D vertical seismic profile (VSP) acquisition was attempted in 1986 by AGIP; several 3D VSP volumes have been acquired since then [1-9]. Apart from the 3D VSP acquisition, a simultaneous VSP and 3D surface seismic acquisition has been attempted [10], and the results have been encouraging in terms of cost effectiveness and the enhanced imaging of the subsurface. This work is an attempt to describe the simultaneous acquisition of 3D surface seismic data, the 3D VSP data and to detail the different steps that were followed to process the two data volumes. Attempts were made to enhance the bandwidth of the 3D seismic data using the VSP downgoing wavefield and integrate the 3D VSP volume with surface seismic to be able to interpret the two together.

Accession: 020024212

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