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Microtensile bond strength to ground enamel by glass-ionomers, resin-modified glass-ionomers, and resin composites used as pit and fissure sealants

Microtensile bond strength to ground enamel by glass-ionomers, resin-modified glass-ionomers, and resin composites used as pit and fissure sealants

Journal of Dentistry 33(6): 459-467

To measure the microtensile bond strength to ground enamel of different types of materials used as pit and fissure sealants in combination with different substrate conditioners. From 40 sound extracted molars, eight groups of five teeth were randomly formed. The experimental groups were: (1) (C) 37% phosphoric acid/ClinPro Sealant (3M ESPE); (2) (G) 37% phosphoric acid/Guardian Seal (Kerr); (3) (E/TF) 37% phosphoric acid/Excite/Tetric Flow (Ivoclar-Vivadent) (4) (OS/UF) 37% phosphoric acid/One Step (Bisco)/UniFil Flow (GC); (5) (OS/AE) 37% phosphoric acid/One Step/AEliteflo (Bisco); (6) (UB/UF) UniFil Bond/UniFil Flow (GC); (7) (CC/FVII) GC Cavity Conditioner/Fuji VII (GC); (8) (CC/FII) GC Cavity Conditioner/Fuji II LC Improved (GC). On the buccal of each tooth, a 5mm high build-up was created by incrementally adding layers of the sealing material on the conditioned enamel. By serially cutting the built-up tooth, multiple beam-shaped specimens about 1mm x 1mm in cross section were obtained, and loaded in tensile (0.5 mm/min) until failure occurred. The bond strengths measured in MPa were: (C) 20.41+/-11.79; (G) 16.02+/-7.99; (E/TF) 24.06+/-9.67; OS/UF 15.63+/-9.00; (OS/AE) 9.31+/-6.05; (UB/UF) 4.96+/-3.46; (CC/FVII) 1.70+/-2.19; (CC/FII) 2.19+/-1.44. The conventional and the resin-modified glass ionomers measured bond strengths significantly lower than those of any resin-based materials. Failure frequently occurred cohesively within the cement. Flowable composites in combination with phosphoric acid and a total-etch adhesive performed similarly to resin-based materials specifically conceived for sealings, such as ClinPro Sealant and Guardian Seal. The bond achieved by resin composite when treating enamel with the self-etching primer used in this study (UniFil Bond) was significantly lower than that developed when the substrate was etched with 37% phosphoric acid.

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Accession: 049591910

Download citation: RISBibTeXText

PMID: 15935265

DOI: 10.1016/j.jdent.2004.11.007

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